Technical Program Committee（TPC）Chair:
Jun Zheng, Southeast University, China

Technical Program Committee（TPC）Co-Chairs:
Jun Zheng (Chair), Southeast University, China
Peter Chong, Auckland University of Technology, New Zealand
Cheng Li, Simon Fraser University, Canada
Pascal Lorenz, University of Haute-Alsace, France
Shiwen Mao, Auburn University, USA

Symposium Co-Chairs:
1. AI-Enabled Communications and Networks Symposium (AICN)
Honggang Zhang, Zhejiang University, China
Maziar Nekovee, University of Sussex, UK
Melike Erol-Kantarci, University of Ottawa, Canada
Junying Chen, South China University of Technology, China

2. Next Generation Networks and Internet Symposium (NGNI)
Zuqing Zhu, University of Science and Technology of China, China
A.S.Madhukumar, Nanyang Technological University, Singapore
Francesco Musumeci, Politecnico di Milano, Italy
Jun Wu, Tongji University, China

3. Communications and Signal Processing Symposium (CSP)
Weixia Meng, Harbin Institute of Technology, China
Xiang Gui, Massey University, New Zealand
Shaodan Ma, University of Macau, China
Michalis Matthaiou, Queen’s University Belfast, UK

4. Mobile and Wireless Networks Symposium (MWN)
Baoxian Zhang, University of Chinese Academy of Sciences, China
Paolo Bellavista, Università di Bologna, Italy
Nathalie Mitton, Inria Lille-Nord Europe, France
Zhi Sun, Tsinghua University, China

5. Communications and Information Security Symposium (CIS)
Rongxin Lu, University of New Brunswick, Canada
Mohamed Mahmoud, Tennessee Tech University, USA
Yogachandran Rahulamathavan, Loughborough University London, UK
Gang Wu, University of Electronic Science and Technology of China, China


TPC Members
Giacomo Bacci, University of Pisa, Italy
Gianmarco Baldini, Joint Research Centre - European Commission, Italy
Saadi Boudjit, University Sorbonne Paris Nord, France
Char-Dir Chung, National Taiwan University, Taiwan
Ibrahim Develi, Erciyes University, Turkey
Yaru Fu, Hong Kong Metropolitan University, China
Zhen Gao, Tianjin University, China
Wei Gong, Tongji University, China
Jichong Guo, Suzhou University of Science and Technology, China
Yu Han, Southeast University, China
Jie Hao, Nanjing University of Aeronautics and Astronautics, China
Qiang Hu, Amazon.com Service LLc, USA
Guanglun Huang, Guilin University of Electronic Technology, China
Remous-Aris Koutsiamanis, IMT Atlantique & STACK (LS2N/Inria), France
Chunxi Li, Beijing Jiaotong University, China
Xiao Li, Southeast University, China
Chang Liu, The Hong Kong Polytechnic University, Hong Kong
Ruofei Ma, Harbin Institute of Technology, China
Ivan Mezei, University of Novi Sad, Serbia
Zahra Mobini, Queen's University Belfast, United Kingdom
Mohammadali Mohammadi, Queen's University Belfast, United Kingdom
Jalel Ben Othman, CentraleSupélec & University of Sorbonne Paris Nord, France
Fei Qin, Chinese Academy of Sciences, China
Tony Q. S. Quek, Singapore University of Technology and Design, Singapore
Yasir Saleem, Aberystwyth University, United Kingdom
Damien Wohwe Sambo, Inria Lille - Nord Europe, France
Aggeliki Sgora, Ionian University, Greece
Yulin Shao, University of Macau, Macau
Ruoyu Su, Nanjing University of Posts and Telecommunications, China
Zeping Sui, Queen's University Belfast, United Kingdom
Wenbin Sun, Northwestern Polytechnical University, China
Rui Tian, Beijing University of Technology, China
Xiang Tian, Qilu University of Technology, China
Shuai Wang, Shenzhen Institute of Advanced Technology, CAS, China
Yik-Chung Wu, The University of Hong Kong, Hong Kong
Yuan Wu, University of Macau, Macao
Tianheng Xu, Shanghai Advanced Research Institute, CAS, China
Jide Yuan, Soochow University, China
Jie Zeng, Beijing Institute of Technology, China
Baoxian Zhang, University of Chinese Academy of Sciences, China
Yuan Zhang, Southeast University, China
Dongmei Zhao, McMaster University, Canada
Wanlong Zhao, Harbin Institute of Technology, China
Yongxiang Zhao, Beijing Jiaotong University, China
Ting Zhou, Shanghai University, China
Deyue Zou, Dalian University of Technology, China